BENDING FATIGUE BEHAVIOR OF AG NANOWIRE/CU THIN-FILM HYBRID INTERCONNECTS FOR WEARABLE ELECTRONICS

Enhancing the mechanical reliability of metal interconnects is important for achieving highly reliable flexible/wearable electronic devices. In this study, Ag nanowire and Cu thin-film hybrid were explored as a novel concept to enhance under bending fatigue. Bending fatigue tests conducted on thin films Cu/Ag nanowire/polyimide (CAP) interconnects. The increase in resistance was larger than CAP. single-component electrodes showed multiple crack initiation propagation due strain, which degraded electrical conductivity. CAP, however, no long-range cracks observed, even after 300,000 cycles bending, although wavy structure probably delamination nanowires repeated bending. Our study confirms that flexible hybrids can